New approach to isotropic texturing techniques on multicrystalline silicon wafers

作者: S. W. Park , D. S. Kim , S. H. Lee

DOI: 10.1023/A:1012824115191

关键词: Materials scienceMetallurgySilicon dioxideShort circuitDeposition (law)OptoelectronicsAcid etchingIsotropySolar cellWafer

摘要: Multicrystalline silicon wafers were isotropically textured using two kinds of modified acid texturing methods. One the modifications is based on introduction spray deposition method into conventional etching Si wafers. Silicon dioxide or photo-resist was sprayed and used as masks for following process. The solution with \( H_2 SO_4 \) various additives. Short circuit densities solar cells fabricated those measured to be in range between 30.8 31.4mA/cm^2 \), which at least 1.6mA/cm^2 higher than from alkaline cells.

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