Method of manufacturing a multilayer circuit board

摘要: Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality circuit layers stacked, one on top other. At least comprise substrate composed polymeric material capable undergoing bonding such as fluoropolymeric based having vias therethrough and comprised layer suitable conductive material. A fusible (e.g., solder) or noble metal is applied wherever electrical connections desired. other comprises cofired ceramic Once stacked subjected to lamination under heat pressure adhere each an adjacent diffuse fuse solder together form integral solid interconnects.