Known good die test apparatus and method
作者： Shaw Wei Lee
DOI:
关键词: Ceramic 、 Chip 、 Flip chip 、 Engineering 、 Electrical conductor 、 Die (integrated circuit) 、 Optoelectronics 、 Integrated circuit 、 Conductor 、 Electrical engineering
摘要: An apparatus and method for testing an integrated circuit chip prior to mounting on a package including non-conductive tape upon which are formed plurality of contacts arranged in pattern matching the arrangement bonding pads circuit, z-axis conductor placed over conductive tape. The target is test signals transmitted between through conductors embedded conductor. In one embodiment, glass or ceramic plate openings, same as pads, prevent damage circuit.
lens.org 参考文章(4)
John Chiechi, Richard J. Pommer, Spring grid array interconnection for active microelectronic elements ,(1989)
Alexandru Stephen Gliga, Dennis Edwards Cummings, William Dominic Carlomagno, Interconnection of electronic components ,(1987)
David R. Hembree, Warren M. Farnworth, Alan G. Wood, Clamped carrier for testing of semiconductor dies ,(1993)
John W. Jamison, Robert E. Allen, Test connector for electrical devices ,(1987)