DSC and FTIR analysis of the curing behaviors of epoxy/DICY/solvent open systems
作者： Shinn-Gwo Hong , Chung-Sheng Wu
DOI: 10.1016/S0040-6031(98)00356-6
关键词: Curing (chemistry) 、 Diglycidyl ether 、 Differential scanning calorimetry 、 Chemistry 、 Analytical chemistry 、 Epoxy 、 Thermal analysis 、 Solvent effects 、 Solvent 、 Fourier transform infrared spectroscopy 、 Chemical engineering
摘要: … (DSC) and Fourier transform infrared spectroscopy (FTIR). From DSC analyses of the specimens … The results from FTIR spectra confirmed that the composition of the cured resin was …
elsevier.com
sci-hub.se 参考文章(22)
Peter Eyerer, Reaktionsverlaut während der härtung eines epoxidharzes mit dizyandiamid Journal of Applied Polymer Science. ,vol. 15, pp. 3067- 3088 ,(1971) , 10.1002/APP.1971.070151215
E. Sacher, Kinetics of epoxy cure: 3. The systems bisphenol-A epoxides/dicy Polymer. ,vol. 14, pp. 91- 95 ,(1973) , 10.1016/0032-3861(73)90055-4
Michael D. Gilbert, Nathan S. Schneider, William J. MacKnight, Mechanism of the dicyandiamide/epoxide reaction Macromolecules. ,vol. 24, pp. 360- 369 ,(1991) , 10.1021/MA00002A004
Roscoe O. Carter, Ray A. Dickie, Joseph W. Holubka, Nancy E. Lindsay, Infrared studies of interfacial reactions of dicyandiamide on zinc Industrial & Engineering Chemistry Research. ,vol. 28, pp. 48- 51 ,(1989) , 10.1021/IE00085A010
W. Jeremy Jones, W. J. Orville-Thomas, The infra-red spectrum and structure of dicyandiamide Transactions of the Faraday Society. ,vol. 55, pp. 193- 202 ,(1959) , 10.1039/TF9595500193
S. G. Hong, J. J. Lin, Effects of DICY content and metal oxide on the curing behavior of a brominated epoxy resin Journal of Applied Polymer Science. ,vol. 59, pp. 1597- 1605 ,(1996) , 10.1002/(SICI)1097-4628(19960307)59:10<1597::AID-APP12>3.0.CO;2-U
R.L. Miller, M.A. Oebser, Determination of cure times and activation energies of one-container epoxy resin systems by isothermal DSC Thermochimica Acta. ,vol. 36, pp. 121- 131 ,(1980) , 10.1016/0040-6031(80)87003-1
W. Brockmann, O.-D. Hennemann, H. Kollek, C. Matz, Adhesion in bonded aluminium joints for aircraft construction International Journal of Adhesion and Adhesives. ,vol. 6, pp. 115- 143 ,(1986) , 10.1016/0143-7496(86)90016-3
Souichi Muroi, Hidekazu Ishimura, Masahiko Outsuka, Reactivity of epoxy resin in dispersed dicyandiamide system and dynamic viscoelasticity of the resulting product Journal of Applied Polymer Science. ,vol. 32, pp. 5095- 5104 ,(1986) , 10.1002/APP.1986.070320528
Pyong-Nae Son, Carl D. Weber, Some aspects of monuron-accelerated dicyandiamide cure of epoxy resins Journal of Applied Polymer Science. ,vol. 17, pp. 1305- 1313 ,(1973) , 10.1002/APP.1973.070170501