作者: T. Kaneko , K. Iida , T. Kono , N. Sakai , M. Murakami
DOI: 10.1016/J.PHYSC.2004.01.088
关键词: Composite material 、 Superconductivity 、 Soldering 、 Ultimate tensile strength 、 Copper 、 Transition metal 、 Materials science 、 Grain boundary 、 Joint (geology) 、 Welding
摘要: Abstract We have performed tensile tests at room temperature for Y–Ba–Cu–O bulk superconductors with artificial grain boundaries, which were fabricated by a joining technique using Ag added solder. The strength of the joint was lower than that mother block Y–Ba–Cu–O. Microstructural analyses revealed residual liquid phase observed in vicinity interface between and solder ac -plane. Cross-sectional observation samples after showed fracture occurred along phase. Hence, responsible strength.