作者: Senol Mutlu , Cong Yu , P. Selvaganapathy , F. Svec , C.H. Mastrangelo
DOI: 10.1109/MEMSYS.2002.984050
关键词: Surface micromachining 、 Electronic engineering 、 Spark plug 、 Bubble 、 Porosity 、 Back pressure 、 Materials science 、 Wafer 、 Necking 、 Composite material 、 Porous medium
摘要: A novel porous polymer was microfabricated to serve as a plug for new device, the electro-osmotic pump (pp-EOP). The eliminates any back pressure effects while enhances flow in channel. pp-EOP batch fabricated by surface micromachining on top of silicon wafer. device is driven periodic, zero-average injected current signal at low frequencies producing bubble-free with reversible net movement. Testing produced an average water-air interface velocity 1.8 /spl mu/m/s 0.8 Hz. increased 4.8 and 13.9 necking channel size.