Polyimide embedded conductor process
作者： Robert L. Beckman , Carl W. Laakso , John J. Reagan
DOI:
关键词: Polyimide 、 Conductor 、 Substrate (printing) 、 Process (computing) 、 Layer (electronics) 、 Composite material 、 Materials science 、 Electrical conductor
摘要: A polyimide embedded conductor process assures adherence of a metal to layer and allows closer spacing between conductors. The is laid on sacrificial substrate, then the over substrate. substrate etched away expose conductor, may be from form attachment tabs.
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