Isolated bump circuitry on tape utilizing electroforming

摘要: A process for electroforming a bump circuit and lead on tape to be used making contact with integrated chips the like. By means of process, an inverse pattern is produced. To this end, first metal plate coated photoresist one surface suitable apertures are made in conventional manner. Now indentations chemically etched, partly through uncovered form circuit. Next completely removed again covered layer photoresist. After developed circuit, etched while at same time further etching indentations. These now by various plating steps. For example, may successively layers gold, nickel, copper, additional gold. The original then chemical etching. Either remaining remain or else new applied over entire structure before final product electroformed provide flexible carrier.