Resin sealed semiconductor device
作者： Kazuichi Komenaka , Toshimitsu Toshiba Nishikawaguchi Ishikawa
DOI:
关键词: Electronic circuit 、 Chip 、 Semiconductor chip 、 Connection (mathematics) 、 Optoelectronics 、 Line (electrical engineering) 、 Semiconductor device 、 Materials science
摘要: A resin sealed semiconductor device having: a chip (1) having an electric circuit therein and elongated main connection line (20) respectively formed thereon; plurality of leads (9) disposed near the (1); electrical connecting wires for electrically together (9); at least one by-pass (100) in correspondence with (20); (11) end thereof to thereof, other thereof.
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