Semiconductor device with smaller package
作者： Mitsuhiro Nakao , Kazunori Hayashi , Toshimitsu Ishikawa
DOI:
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摘要: Disclosed is a semiconductor device comprising an integrated circuit chip, first lead having portion extending substantially in parallel to one side plurality of the and second located adjacent lead. Each leads has recess projection continuously. The are arranged each other with being engagement Bonding wires bonded on bonding electrically connect chip also
lens.org 参考文章(4)
Mitsuhiro Nakao, Kazunori Hayashi, Toshimitsu Ishikawa, Semiconductor device with smaller package having leads with alternating offset projections ,(1995)
Takahata Kazumi, CIRCUIT DEVICE SEALED WITH INSULATOR ,(1988)
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Kazuichi Komenaka, Toshimitsu Toshiba Nishikawaguchi Ishikawa, Resin sealed semiconductor device ,(1991)