Quick prototyping of flip chip assembly with MEMS
作者： R. Irwin , Wenge Zhang , K. Harsh , Y.C. Lee
DOI: 10.1109/RAWCON.1998.709194
关键词: Coplanar waveguide 、 Thermosonic bonding 、 Wire bonding 、 Substrate (printing) 、 Optoelectronics 、 Microelectromechanical systems 、 Flip chip 、 Capacitor 、 Materials science 、 Electronic engineering 、 Microwave
摘要: This paper describes a process to transfer microelectromechanical systems (MEMS) devices secondary substrate using flip-chip thermosonic bonding. A standard wire-bonding machine was used place /spl sim/100-/spl mu/m bumps on unreleased MEMS chiplets. The bumped chiplet then bonded containing microwave coplanar waveguide (CPW). After bonding, the entire assembly run through release process, after which host removed. bonding very reliable prototyping tool with 100% yield. can be any that wire bonded. also applied variety of applications.
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