作者: H. Song , Y.S. Oh , I.S. Song , S.J. Kang , S.O. Choi
DOI: 10.1109/MEMSYS.2000.838571
关键词: Fabrication 、 Gyroscope 、 Etching (microfabrication) 、 Electrical engineering 、 Materials science 、 Vacuum level 、 Wafer-scale integration 、 Crystalline silicon 、 Surface micromachining 、 Optoelectronics 、 Wafer
摘要: A highly reliable, wafer level vacuum packaged and de-coupled vertical microgyroscope was developed. The gyroscope which had four driving springs two sensing designed fabricated. new fabrication process could realize a high aspect ratio use thick single crystalline silicon as structure layer, proposed. environment for operating vibratory accomplished with packaging at level. of ambient pressure about 150 mtorr. resolution the 0.013/spl deg//sec/Hz/sup 1/2/. output nonlinearity below 2% in /spl plusmn/100/spl deg//s full scale.