Wafer-Level Discrete Power Mosfet Package Design

作者: Shichun Qu , Yong Liu

DOI: 10.1007/978-1-4939-1556-9_5

关键词: Electronic engineeringPower densityPower management systemTransistorPower semiconductor devicePower managementComputer sciencePower MOSFETPower (physics)Insulated-gate bipolar transistor

摘要: … that make up the power management system. This chapter introduces the design of discrete power package and the analysis of the wafer-level discrete power package performance. …

参考文章(9)
George G Harman, Wire bonding in microelectronics McGraw-Hill. ,(2010)
Ahmer Syed, Tong Yan Tee, Hun Shen Ng, Rex Anderson, Choong Peng Khoo, Boyd Rogers, Advanced analysis on board trace reliability of WLCSP under drop impact Microelectronics Reliability. ,vol. 50, pp. 928- 936 ,(2010) , 10.1016/J.MICROREL.2010.02.027
Jong-In Ryu, Se-Hoon Park, Dongsu Kim, Jun-Chul Kim, Jong-Chul Park, A mobile TV/GPS module by embedding a GPS IC in printed-circuit-board electronic components and technology conference. pp. 1668- 1672 ,(2012) , 10.1109/ECTC.2012.6249062
Tong Yan Tee, Bin Tan Long, Rex Anderson, Shen Ng Hun, Jim Hee Low, Choong Peng Khoo, Robert Moody, Boyd Rogers, Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test electronics packaging technology conference. pp. 1086- 1095 ,(2008) , 10.1109/EPTC.2008.4763574
Shichun Qu, Jihwan Kim, Glen Marcus, Matt Ring, 3D Power module with embedded WLCSP electronic components and technology conference. pp. 1230- 1234 ,(2013) , 10.1109/ECTC.2013.6575732
Dionysios Manessis, Lars Boettcher, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl, Chip embedding technology developments leading to the emergence of miniaturized system-in-packages electronic components and technology conference. pp. 803- 810 ,(2010) , 10.1109/ECTC.2010.5490733
M. Daggubati, Q. Wang, Y.V. Sokolov, Yong Liu, Lu-Chang Qin, Dependence of the Fracture of PowerTrench MOSFET Device on Its Topography in Cu Bonding Process IEEE Transactions on Components and Packaging Technologies. ,vol. 32, pp. 73- 78 ,(2009) , 10.1109/TCAPT.2008.2005733
Yong Liu, Scott Irving, Timwah Luk, Thermosonic wire bonding process simulation and bond pad over active stress analysis electronic components and technology conference. ,vol. 31, pp. 61- 71 ,(2004) , 10.1109/TEPM.2007.914232
Yong Liu, Power Electronic Packaging Springer New York. ,(2012) , 10.1007/978-1-4614-1053-9