Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test

摘要: The Wafer Level Chip Scale Package (WLCSP) is gaining popularity for its performance and ability to meet miniaturization requirements of portable consumer electronics, such as cell phones. Due differential bending between the silicon die PCB large stiffness difference, board level drop/bend tests are widely accepted methods evaluate damage in parts when a handheld device dropped by consumer. Through an aggressive product development program which includes experiment simulation Amkor has developed next WLCSP (CSPnlTM), exhibits superior reliability subjected drop impact, strong requirement electronics. common industrial qualification criterion withstand at least 40 drops before first failure (FF) under JEDEC test condition 1500 G/0.5 ms. With optimal CSPnl designs, recent results show that typical with size 5.4 mm × minimum failure-free life over 1000 drops. For enhanced design, first-failure 4860 was recorded actual testing. These excellent imply much larger possible future products, opening door wider applications devices, e.g. next-generation electronics greater function integration.