Finite Element Modeling of System Design and Testing Conditions for Component Solder Ball Reliability Under Impact
作者： Xuejun Fan , A. S. Ranouta
DOI: 10.1109/TCPMT.2012.2204884
关键词:
摘要: In this paper, the effects of system design and testing conditions on dynamic behavior solder balls components are studied through finite element analysis. The current JEDEC drop test board (JESD22-B111) is used as a baseline model. model then extended to several new configurations, which consider major component placement, secondary attachment, orientations at level. Some findings summarized follows. There exists region near mounting support, where bends in opposite direction center. This localized bend mode causes excessive stresses for close support areas. attachment side has different effects: symmetric placement can reduce component. However, off-centered gives rise additional far edge component, therefore lead higher failure rate. Components respond differently under 0° (face-down) 180° (face-up) horizontal drops, respectively, magnitude tensile compressive one vibrational period not symmetric. addition, may be worst orientation ball damages, compared other orientations. vertical (90°) very limited damages balls. above predictions have been verified experimentally. results provide insight system- board-level designs product development.
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