Drop reliability performance assessment for PCB assemblies of chip scale packages (CSP)
作者： D.Y.R. Chong , H.J. Toh , B.K. Lim , P.T.H. Low , J.H.L. Pang
DOI: 10.1109/EPTC.2005.1614404
关键词:
摘要: Drop impact reliability assessment of solder joints on the chip scale packages is critical for use in miniature handheld products. Replacement lead-based with lead-free solders requires need evaluating its compatibility existing printed circuit board surface finishes. A 15 times 15mm fine-pitch BGA ball compositions 36Pb-62Sn-2Ag and Sn-4Ag-0.5Cu finishes organic solderability preservative, electroless nickel immersion gold tin were tested. The results revealed a strong influence different intermetallic compound formation soldered assemblies drop durability. supersedes composition regardless types finish. Joints preservative found to be strongest each type. Other factors affecting such as component location orientation are reported
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