Drop impact life prediction model for lead-free BGA packages and modules

摘要: System-in-package (SiP) such as multi-chip or stacked die BGA modules with wirebond, flip-chip hybrid interconnect are getting popular for advanced packaging applications. The design of SiP is more dependent on modeling the package structure and failure mechanism too complicated to be studied. It known that drop impact reliability lead-free solder joints a critical challenge. Drop life IC packages mounted board becomes hot topic, especially qualification handheld electronic products. Actual test sample preparation very expensive time-consuming, requiring much manpower in measurement analysis, therefore, there limited results reported advise enhancement, packages. In this paper, various parameters studied experimentally numerically, understand effects ball height, size, layout. A thorough understanding variables obtained based well-designed controlled experiments. On other hand, 10 different layout, thickness tested well-controlled tester. For first time, an accurate prediction model established (SnAgCu) modules, having good correlation 16 cases actual level testing results. This quantitative approach from traditional qualitative modeling, it provides both relative absolute prediction. validated applied provide guidelines lead'free improve their reliability. One point noted performance may under thermal cycling test. Therefore, should considered, depending application area concern.