Drop impact life prediction models with solder joint failure modes and mechanisms
作者： Jing-en Luan , Tong Yan Tee , Xueren Zhang , E. Hussa , J. Wang
DOI: 10.1109/EPTC.2005.1614369
关键词: Failure mode and effects analysis 、 Composite material 、 Drop impact 、 Soldering 、 Integrated circuit packaging 、 Stress (mechanics) 、 Metallurgy 、 Stress concentration 、 Stress–strain curve 、 Joint (geology) 、 Materials science
摘要: Drop impact performance of solder joints IC packages becomes a great concern for handheld products, such as mobile phones and PDA. Failure modes under drop depend on alloys, interfacial strength, intermetallic formulation, etc. Submodeling technique is applied to model detailed structure critical joint. The stress strain concentration at different locations joint correlate well with failure observed during testing. Eutectic more susceptible bulk while Sn-4Ag-0.5Cu compound (IMC) layer failure. Softness Sn-37Pb reduces the in IMC increases plastic strains solder. Life prediction determined by mode mechanism. Stress criteria suitable brittle crack should be life ductile
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