Solder stability for Pb-free HBGA assembly with oxygenous reflow
作者： Tien-Tsorng Shih , Wei-Chih Chen , Win-Der Lee , Mu-Chun Wang , None
DOI: 10.1109/IMPACT.2011.6117249
关键词:
摘要: In ball-grid-array (BGA) package technology, the oxygen concentration in flow process predominantly influences quality of solder conjunction such as oxidation causing aged effect and inter-metallic compound. addition, flux assistance is also a key factor determining adhesion ability between carrier HBGA substrate ball. Using temperature cycling test, shear test drop to distinguish for lead-free balls on assisted with several fluxes, optimal recipe was achieved. The soldering performance impressive.
sci-hub.se 参考文章(9)
R. Erich, R.J. Coyle, G.M. Wenger, A. Primavera, Shear testing and failure mode analysis for evaluation of BGA ball attachment international electronics manufacturing technology symposium. pp. 16- 22 ,(1999) , 10.1109/IEMT.1999.804791
M. Sorricul, Jing-en Luan, Tong Yan Tee, Kim Yong Goh, Hun Shen Ng, X. Baraton, R. Brenner, Drop impact life prediction model for lead-free BGA packages and modules international conference on thermal mechanial and multi physics simulation and experiments in micro electronics and micro systems. pp. 559- 565 ,(2005) , 10.1109/ESIME.2005.1502867
M. Painaik, D.L. Santos, A.J. McLenaghan, P. Chouta, S.K. Johnson, Effect of flux quantity on Sn-Pb and Pb-free BGA solder shear strength international electronics manufacturing technology symposium. pp. 229- 237 ,(2002) , 10.1109/IEMT.2002.1032760
Yu Wang, Liqiang Cao, A study on the application of soldering flux on the solder balls of BGA packages international conference on electronic packaging technology. pp. 405- 409 ,(2010) , 10.1109/ICEPT.2010.5582858
Ramgopal V. Uppalapati, Kristie Leiser, Mark Van Sickle, Satish Parupalli, Vasu Vasudevan, Board Design Influence on BGA Mechanical Reliability electronic components and technology conference. pp. 1788- 1795 ,(2007) , 10.1109/ECTC.2007.374039
Karel Dusek, Jan Urbanek, Influence of the reduced oxygen concentration on the wetting force international spring seminar on electronics technology. pp. 193- 196 ,(2006) , 10.1109/ISSE.2006.365384
Chun-Chi Chiu, Yun-Tsung Li, Hsun-Fa Li, Chuei-Tang Wang, Fine pitch BGA solder joint split in SMT process international microsystems, packaging, assembly and circuits technology conference. pp. 602- 605 ,(2009) , 10.1109/IMPACT.2009.5382257
G. Di Giacomo, Modeling the effect of oxygen on the fatigue lifetime of solder joints international reliability physics symposium. pp. 93- 96 ,(1995) , 10.1109/RELPHY.1995.513660
B. Tavassoli, Thermal response of the ultra-performance BGA heat sink in ducted and unducted flow conditions...an experimental investigation The Electrician. pp. 125- 136 ,(1999) , 10.1109/ELECTR.1999.779351