Effect of reflow technology and surface finishes of PCB on solder spreading
作者： K Dušek , J Vávra , A Rudajevová
DOI: 10.1109/ISSE.2013.6648230
关键词:
摘要: A key process in surface mount technology is soldering, when a metallurgical joint formed between the molten solder and metal surfaces. Solders state have to show good spreading action together with wetting of substrate. Molten flows or spreads on ensure future formation joint. Monitoring one tools which can be used solderability wettability quantification. Measurement solders that estimation their solderability. Each has different degree surface. Degree mainly depends combination flux, alloy, soldered This study focused investigate effect reflow PCBs finishes solders. In our experiment we four types (lead free HASL., passivated cooper, ENIG immersion Sn), five pastes (one lead Sn62Pb36Ag2 Sn96.5Ag3Cu0.5, Sn95.5Ag4Cu0.5, Sn96.5Ag3.5, Sn42Bi58) three technologies - continuous hot air infra radiation soldering vapor phase soldering.
sci-hub.se 参考文章(4)
Tien-Tsorng Shih, Wei-Chih Chen, Win-Der Lee, Mu-Chun Wang, None, Solder stability for Pb-free HBGA assembly with oxygenous reflow 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). pp. 435- 438 ,(2011) , 10.1109/IMPACT.2011.6117249
Karel Dusek, Jan Martinek, Image analysis of solder spread factor on different material types international spring seminar on electronics technology. pp. 1- 4 ,(2009) , 10.1109/ISSE.2009.5207059
Petr Harant, Frantisek Steiner, Solderability of lead-free surface finished PCB international spring seminar on electronics technology. pp. 388- 392 ,(2007) , 10.1109/ISSE.2007.4432885
Tomas Novak, Frantisek Steiner, The area of spread solderability test use for roughness influence assessment international spring seminar on electronics technology. pp. 160- 165 ,(2010) , 10.1109/ISSE.2010.5547277