Dynamic behavior tests of lead-free solders at high strain rates by the SHPB technique
作者： Qin Fei , An Tong , Chen Na
DOI: 10.1109/ICEPT.2008.4607060
关键词:
摘要: Dynamic behavior of solder joints in microelectronic packages is key issue for drop/impact reliability design mobile electronic products. The dynamic mechanical behaviors 63Sn37Pb, 96.5Sn3.5Ag and 96.5Sn3.0Ag0.5Cu alloys at high strain rate were investigated by using the split Hopkinson pressure/tension bar testing technique. Stress-strain curves three materials obtained 600 s−1, 1200 s−1 2200 respectively. experimental results show that all are strongly dependent. Among them most sensitive to rate, while has greatest yield stress tensile strength. Relations strength, fracture with proposed fitting data.
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