Evaluation of board-level reliability of electronic packages under consecutive drops
作者： Chang-Lin Yeh , Yi-Shao Lai , Chin-Li Kao
DOI: 10.1016/J.MICROREL.2005.09.002
关键词: Numerical analysis 、 Soldering 、 Plasticity 、 Electronic packaging 、 Chip-scale package 、 Drop (liquid) 、 Stress–strain curve 、 Structural engineering 、 Engineering 、 Transient response
摘要: Abstract In general, the drop reliability of a board-level electronic package is characterized by number drops to failure according certain criterion. This implies that damage solder joints evolves during each and eventually leads failure. Development numerical method capable obtaining accumulated stresses strains under consecutive conditions therefore in need because without these factors, accurate predictions for packages are unattainable. We implement this paper support excitation scheme incorporated with implicit time integration study transient structural responses chip-scale subjected drops. Accumulated stresses, plastic strains, strain energy densities on repetitive impacts investigated.
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