Design for reliability (DFR) methodology for electronic packaging assemblies
作者： J.H.L. Pang , T.H. Low , B.S. Xiong , F. Che
DOI: 10.1109/EPTC.2003.1271567
关键词:
摘要: … conventional 2D and 3D Finite Element Analysis is provided for Thermal Cycling … modeling viscoelastic underfill and viscoplastic solder is reported for thermal cycling (TC) and thermal …
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researchgate.net 参考文章(13)
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