Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
作者： G. Z. Wang , Z. N. Cheng , K. Becker , J. Wilde
DOI: 10.1115/1.1371781
关键词:
摘要: … The material parameters with viscoplastic constitutive … /strain responses under thermal cyclic loading for comparison and … the estimation of failure indicator such as the cyclic inelastic …
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