Lead free solder joint reliability characterization for PBGA, PQFP and TSSOP assemblies
作者： F.X. Che , J.H.L. Pang , B.S. Xiong , Luhua Xu , T.H. Low
DOI: 10.1109/ECTC.2005.1441381
关键词: Soldering 、 Surface finish 、 Temperature cycling 、 Metallurgy 、 Weibull distribution 、 Joint (geology) 、 Failure mode and effects analysis 、 Mean time between failures 、 Daisy chain 、 Composite material 、 Materials science
摘要: In this study, thermal cycling test from -40/spl deg/C to 125/spl with 1 hour per cycle for Sn/sub -3.8/Ag/sub -0.7/Cu solder joint electronic assemblies was conducted PBGA316, PQFP208, PQFP176, and TSSOP48 components. Two PCB surface finish conditions were investigated ENIG OSP. Daisy chain, in-situ resistance monitoring data logger, used failure detection when the value is larger than 300/spl Omega/. A two-parameter Weibull distribution model determine mean time (MTTF) different The parameters such as characteristic life slope are compared PBGA assembly Ni/Au OSP finishes. Microscopy crack path mode. It shown that components have higher fatigue those finish. joints more sensitive in PQFP TSSOP More failures occur at package side board assembly. Fatigue prediction using FEA analysis results component types. Quarter submodeling technique simulation due symmetric geometry uniform loading PBGA, assemblies. Effect of location on studied based result predicted a good agreement
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