HIGH-DENSITY ARRAY FREE-FORM SURFACE MINIATURE ELECTRODE AND MANUFACTURING METHOD THEREFOR

摘要: A high-density array free-form surface miniature electrode, comprising a substrate (1) and number of electrode columns (2). The comprises welding stimulation surface. (2) comprise column head tail. run through the (1), tails are on same plane as surface, heads protrude from Common nerve electrodes often have thereof arranged inside substrate, then lead wires interior to connect chip. Compared with existing structure, structure is more convenient manufacture suitable for mass production, exposed allowing pins chip (3) be directly connected (2), eliminating need simplifying manufacturing process.