作者: Swaminathan Rajaraman , James D. Ross , Amanda Preyer , Julian A. Bragg
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摘要: Implementations disclosed herein provide for a microneedle electrode system comprising patch connected to external electronics. The comprises first flexible substrate having plurality of conductive pads disposed thereon, three-dimensional, individually addressable arrays where each array has microneedles extending from an upper surface thereof and lower adapted contact corresponding one the on substrate, second openings defined therein dimensioned accommodate at least portion which extend. Each is in electrical communication with are bonded together such that extends through substrate.