Semiconductor devices and packages having through electrodes
作者： Hyeong Seok Choi
DOI:
关键词: Semiconductor 、 Fabrication methods 、 Electrode 、 Memory cards 、 Materials science 、 Optoelectronics 、 Electronic systems 、 Semiconductor device 、 Substrate (printing)
摘要: A semiconductor device includes a substrate having first surface and second that are opposite to each other, plurality of through electrodes penetrating the extending from surface, front-side bumps disposed on connected odd-numbered among electrodes, backside even-numbered electrodes. Related packages, fabrication methods, electronic systems memory cards also provided.
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