Stacked semiconductor chips packaging

作者: Lei Fu , Michael Zhuoying Su , Frank Gottfried Kuechenmeister

DOI:

关键词: Electrical engineeringSemiconductorStack (abstract data type)OptoelectronicsSubstrate (printing)Printed circuit boardSemiconductor chipPluralMaterials scienceElectrical conductor

摘要: Various methods and apparatus for joining stacked substrates to a circuit board are disclosed. In one aspect, method of manufacturing is provided that includes coupling plural form stack. At least the semiconductor chip. Plural conductive vias formed in first substrates. Each end positioned substrate second projecting out substrate.