Applications of dry photoresist film for printed and flexible electronics

摘要: This work presents three applications of dry photoresist film for printed and flexible electronics devices. First, as part the encapsulation gas sensors (i.e. humidity). process was performed at relatively low temperatures (85 °C) shown to be mechanically robust. Second, mechanical protection layer circuitry increase robustness bending forces protect against environmental-induced wear. Mechanical increased by optimizing neutral plane position. Third, integration interconnection SMD components on foil. The electrical interconnections are realized using conductive adhesive filled-vias through film, which is also used fixation components.