作者: Lei Wu , Huikai Xie
DOI: 10.1117/1.3082186
关键词: Wafer 、 Flatness (systems theory) 、 Optical coherence tomography 、 Silicon on insulator 、 Optics 、 Optical tomography 、 Reflection (physics) 、 Etching (microfabrication) 、 Surface micromachining 、 Materials science
摘要: We report the design, fabrication, and measurements of a dual-reflective, single-crystal silicon-based micromirror that can perform circumferential scanning for endoscopic optical coherence tomography (EOCT). Full 360-deg scan angle (OSA) be achieved by using dual-reflective mirror with ±45-deg (or 90-deg) mechanical (MSA), where each reflective surface contributes 180-deg scanning. A novel surface- bulk-combined micromachining process based on silicon insulator (SOI) wafers is developed fabricating micromirror. The flatness maintained single-crystal-silicon device layer SOI wafers, aluminum coated both sides reflection. fabricated demonstrated about half range at resonance 425 Hz. Other measured data include radii curvature, −129 mm (front surface) 132 (back surface), reflectance, 86.3% 84.2% surface). This has potential to realize full-circumferential-scanning EOCT imaging.