Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

作者: Takeshi Yanagita , Kazuhide Yokota , Shin Iwabuchi , Yasushi Maruyama

DOI:

关键词: Solid-stateElectric chargeElectronic circuitMaterials sciencePickupOptoelectronicsElectric fieldPixelSaturation (magnetic)Electrical engineering

摘要: A back-illuminated type solid-state image pickup device ( 1041 ) includes read circuits (Tr 1 , Tr 2 formed on one surface of a semiconductor substrate 1042 to signal from photo-electric conversion element (PD) the ), in which electric charges (e) generated region 1052 c under at least portion are collected an charge accumulation side by field within (PD). Thus, and camera able make size pixel become very small without lowering saturation amount (Qs) sensitivity.

参考文章(38)
Hiroki Sato, Takashi Abe, Keiji Mabuchi, Tomoyuki Umeda, Eiichi Funatsu, Hiroaki Fujita, Nobuo Nakamura, Solid state image pickup device and method of producing solid state image pickup device ,(2007)
Ephie Koltin, Yacov Malinovich, Backside illuminated image sensor ,(1999)
Louis Brissot, Philippe Rommeveaux, Eric Pourquier, Alain Jutant, Gilles Simon, Colour image sensor with enhanced calorimetry and method for making same ,(2002)
Gary E. Slayton, Kwang-Bo Cho, Sandor L. Barna, Michael Kaplinsky, Igor Subbotin, High intrascene dynamic range NTSC and PAL imager ,(2002)
Junya Maruyama, Shunpei Yamazaki, Toru Takayama, Method of peeling off and method of manufacturing semiconductor device ,(2002)
Jon J. Candelaria, Paige M. Holm, Integrated photoserver for CMOS imagers ,(2004)
Hiroyuki Mori, Hideshi Abe, Yasushi Maruyama, Solid-state imaging device and method for manufacturing the same ,(2009)
Tadashi Ogawa, Akihiro Ishii, Yuichi Nakayoshi, Method for fabricating an SOI substrate ,(1996)
Paul Arthur Layman, John Russell McMacken, High-density inter-die interconnect structure ,(2003)