作者: Kai Chen , N. Tamura , B. C. Valek , K. N. Tu
DOI: 10.1063/1.2952073
关键词: Condensed matter physics 、 X-ray crystallography 、 Plasticity 、 Electromigration 、 Crystallography 、 Materials science 、 Synchrotron radiation 、 Slip (materials science) 、 Deformation (engineering) 、 X-ray 、 Synchrotron
摘要: We report here an in-depth synchrotron radiation based white beam X-ray microdiffraction study of plasticity in individual grains Al (Cu) interconnect during the early stage electromigration. The shows a rearrangement geometrically necessary dislocations (GND) bamboo typed that stage. find about 90percent GNDs are oriented so their line direction is closest to current flow direction. In non-bamboo grains, Laue peak positions shift, indicating rotate. An analysis terms force directions has been carried out and consistent with observed electromigration induced grain rotation bending.