Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n , and Implications for EM Reliability Assessment

摘要: While Black’s equation for electromigration (EM) in interconnects with n = 1 is rigorously based on the principles of electrotransport, > more commonly observed empirically. This deviation usually attributed to Joule heating. An alternative explanation suggested by recent discovery EM plasticity. To examine this possibility, we have retested samples that had been previously subjected a predamaging phase high temperature and current densities determine whether loss median time failure (MTF) retained. We find predamaged exhibit MTFs are permanently reduced, which characteristic