Process for producing solar cell, process for producing thin-film semiconductor, process for separating thin-film semiconductor, and process for forming semiconductor
作者： Kiyofumi Sakaguchi , Masaaki Iwane , Takao Yonehara , Shoji Nishida
DOI:
关键词: Materials science 、 Porous silicon 、 Silicon 、 Layer (electronics) 、 Optoelectronics 、 Monocrystalline silicon 、 Solar cell 、 Wafer 、 Electronic engineering 、 Surface micromachining 、 Substrate (electronics)
摘要: A crystal silicon substrate is anodized to form a porous layer thereon, and thin-film grown by epitaxial growth on the layer. Openings extending from surface of reaching are provided applying laser beams, selectively etched through openings separate substrate. The separated transferred another supporting solar cell. Also, layers serving as separation formed wafer both sides, semiconductor (thin-film single-crystal silicon) layers. Then, made in Thereafter, removed wet etching carried out two simultaneously wafer. When cells formed, used electricity generation layers, holes for contact electrode. back electrode further each layer, this attached base conductive via an insulating
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