Method of making electronic entities
作者： Ahmed Nur Amin , John William Osenbach , John Michael DeLucca , Frank A. Baiocchi , Mark Adam Bachman
DOI:
关键词: Soldering 、 Electrical connection 、 Small particles 、 Power semiconductor device 、 Nickel 、 Integrated circuit 、 Structural engineering 、 Connection (vector bundle) 、 Materials science 、 Layer (electronics) 、 Mechanical engineering
摘要: Many electronic entities such as integrated circuits and discrete power devices have contact pads formed from successively deposited layers of nickel a second metal gold. The resulting pad structure is used to make external electrical connection solder connection. Problems associated with failure connections are avoidable by inspecting the surface layer for excessive small particle formation.
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