作者: Louis Regniere , Omid S. Jahromi , William H. Tanubrata , Honorio R. Ulep , Bryce M. Barbato
DOI:
关键词: Electroplating 、 Composite number 、 Electrode 、 Overlay 、 Composite material 、 Copper 、 Immersion (virtual reality) 、 Integrated circuit 、 Fingerprint recognition 、 Materials science
摘要: Provided herein is a method of making an integrated circuit device using copper metallization on 1-3 PZT composite. The includes providing overlay electroplated immersion gold (Au) to cover metal traces, the preventing oxidation 1 :3 composite with material. Also included formation Au nickel electrodes achieve pad for external connections.