Differential pressure sensing device and fabricating method therefor
作者： Chun-Hsun Chu , Jung-Tai Chen , Wen-Lo Shieh
DOI:
关键词: Analytical chemistry 、 Layer (electronics) 、 Molding (process) 、 Optoelectronics 、 Active surface 、 Differential pressure 、 Materials science
摘要: At least one differential pressure sensing device has an active surface with region and a back recess. Next, sacrificial layer is formed on of the region. Then, bonded electrically coupled carrier that at through-hole corresponding to recess device. Afterwards, molding compound encapsulate while exposing upper layer. solvent used naturally decompose layer, such exposed atmosphere, thereby forming package through-hole.
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