Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a mems microphone and packaged device obtained thereby
作者： Federico Giovanni Ziglioli
DOI:
关键词: Materials science 、 Optoelectronics 、 Process (computing) 、 Die (integrated circuit) 、 Mems microphone 、 Electronic engineering 、 Molding (decorative) 、 Mechanical sensor
摘要: In order to manufacture a packaged device, die having sensitive region is bonded support, and packaging mass of moldable material molded on the support so as surround die. During molding mass, chamber formed, which faces connected outside environment. To this end, sacrificial that may evaporate/sublimate dispensed region; mass; through hole formed in extend far evaporated/sublimated hole.
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