Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof

摘要: A microelectromechanical-acoustic-transducer assembly has: a first die integrating MEMS sensing structure having membrane, which has surface in fluid communication with front chamber and second surface, opposite to the back of microelectromechanical acoustic transducer, is able undergo deformation as function incident acoustic-pressure waves, faces rigid electrode so form variable-capacitance capacitor; die, an electronic reading circuit operatively coupled supplying electrical output signal capacitive variation; package, housing base substrate external contacts. The dice are stacked package directly connected together mechanically electrically; delimits at least one chambers.