Method for screen printing solder paste onto a substrate with device premounted thereon
作者： Michael D. Bramel , David B. Metzger , Glenn S. Johnson
DOI:
关键词: Materials science 、 Composite material 、 Fabrication 、 Screen printing 、 Engineering drawing 、 Substrate surface 、 Aperture (computer memory) 、 Solder paste 、 Substrate (printing)
摘要: A printing screen for fabrication substances such as solder paste has an aperture formed therein so that the may be placed on a substrate surface with pre-mounted device extending through aperture. metal cap is bonded to over protect against damage during subsequent operation. Different elements may, therefore, in completely independent steps without need fluxing operations later bonding operations.
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