Method of mounting interrelated components.
作者： Andrzej Tadeusz Guzik
DOI:
关键词: Structural engineering 、 Component (thermodynamics) 、 Microprocessor 、 Fixture 、 Lead frame 、 Mechanical engineering 、 Substrate (printing) 、 Engineering 、 Wave soldering
摘要: One specially designed fixture allows two components such as a microprocessor and its associated ROM to be simultaneously mounted on opposite surfaces of the substrate, with all or nearly internal connections made through area substrate between components. A second for wave soldering lead frames assembly while protecting reflow soldered The method thus provides most direct external by automatic operations. third component can positioned astraddle minimum lengths.
google.co.in 参考文章(18)
Mark Joseph Michaels, Fixture for soldering integrated circuit chips to a multilayer substrate ,(1976)
Stanley J. Wright, Method and holding fixture for soldering lead frames to hybrid substrates ,(1978)
E Hausman, Hybrid electron device containing semiconductor chips ,(1972)
Daniel J. Devlin, Integrated circuit package and lead frame ,(1979)
James R Mars, Frederick S Ciepiela, Printed circuit board construction ,(1970)
Joseph F. Pollitt, Ernest E. Deveres, Paul J. Ouellette, Assembling leads to a substrate ,(1978)
John Francis Gogal, Double cavity semiconductor chip carrier ,(1981)
Nicholas J. Cedrone, Test contactor system for semiconductor device handling apparatus ,(1976)
Rudolf Hoeppe, Horst Wagner, Horst Frohlich, Assembly for supporting and enclosing electrical and electronic components ,(1969)