Integrated circuit package and lead frame

摘要: An improved integrated circuit ceramic package meeting JEDEC-11 standards and having a nominal pin (lead) count of from 24 to 156. Control measures assembly procedures referenced the precise center die-attach area provide closer dimensional control lead coplanarity which facilitate automatic wire-bonding operations. A frame is provided with both diagonal axial (X-Y) registration points, internal external tie-bars. It precisely attached in special tools cover element, tie bars are sheared off. The sub-assembly then secured base similar tools. Devitrification sealing glass follows. form convenient carrier protecting leads, points siting for wire bonding.