Stacked chip assembly
作者： Igor Y. Khandros , Thomas H. DiStefano
DOI:
关键词:
摘要: A semiconductor chip assembly, comprises a first having front surface, rear surface and contacts on the second surface. The of is juxtaposed with chip. assembly includes backing element electrically conductive terminals. so that at least some terminals overlie At chips are connected to substrate contact pads thereon. substrate. adapted connect other elements circuit.
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