Effect of electron flow on the microstructure and mechanical property of Cu/Sn–30Bi/Cu solder joint
作者： Zhongmin Lai , Xinda Kong , Qingrong You
DOI: 10.1007/S10854-016-6085-X
关键词: Metallurgy 、 Soldering 、 Anode 、 Eutectic system 、 Ball grid array 、 Materials science 、 Solder paste 、 Cathode 、 Scanning electron microscope 、 Microstructure
摘要: Non-eutectic Sn–30Bi solder alloy/joint always formed during surface mounting of BGA component, due to the application pure Sn bump and Sn–58Bi paste. In order investigate microstructure mechanical property evolution joint electro-migrated at temperature between solidus liquidus, electro-migration test Cu/Sn–30Bi/Cu was conducted 160 °C. The observed by optical microscope scanning electron microscope. tested universal testing machine. results showed that eutectic phase would migrate towards anode side segregate on Cu pad side. interfacial IMCs layer liquid pad. cathode solid Sn–11Bi thickness all thicker than without flow.
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