A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage

摘要: Our goals in this paper are to develop and demonstrate a computationally efficient methodology for assessing the effect of circuit board warpage, component solder volume variation on shape joints area array packages. The warpage is analyzed using two-step procedure present paper. In first step, restoring forces moments (in molten state droplet) that result from given joint height, material volume, pad diameter, inclination predicted surface tension theory. second step analysis, at individual caused by varying heights tilts combined predict equilibrium configuration package. A program written MATHEMATICAL environment was developed implement above-described methodology. validated an experimental test vehicle with nine joints. computed matched experimentally measured within ±5% error. Further, general capabilities modeling demonstrated assuming complex combinations package PCB warpage.