Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints
作者： Y. W. Chan , T. H. Ju , Saeed A. Hareb , Y. C. Lee , Jih-Shun Wu
DOI: 10.1115/1.1451844
关键词: Soldering 、 Reliability (statistics) 、 Ball grid array 、 Image warping 、 Structural engineering 、 Computer science
摘要:
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sci-hub.se 参考文章(6)
J. S. Corbin, Finite element analysis for solder ball connect (SBC) structural design optimization Ibm Journal of Research and Development. ,vol. 37, pp. 585- 596 ,(1993) , 10.1147/RD.375.0585
S. K. Patra, S. S. Sritharan, Y. C. Lee, Quantitative characterization of a flip-chip solder joint Journal of Applied Mechanics. ,vol. 62, pp. 390- 397 ,(1995) , 10.1115/1.2895943
Y.-H. Pao, A fracture mechanics approach to thermal fatigue life prediction of solder joints IEEE Transactions on Components, Hybrids, and Manufacturing Technology. ,vol. 15, pp. 559- 570 ,(1992) , 10.1109/33.159886
Wei Lin, S.K. Patra, Y.C. Lee, Design of solder joints for self-aligned optoelectronic assemblies IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. ,vol. 18, pp. 543- 551 ,(1995) , 10.1109/96.404114
S. M. Heinrich, P. E. Liedtke, N. J. Nigro, A. F. Elkouh, P. S. Lee, Effect of Chip and Pad Geometry on Solder Joint Formation in SMT Journal of Electronic Packaging. ,vol. 115, pp. 433- 439 ,(1993) , 10.1115/1.2909353
Y. W. Chan, S. Hareb, Y. C. Lee, Teh-Hua Ju, An Integrated Model for Ball Grid Array Solder Joint Reliability Multichip Modules. ,vol. 2575, pp. 308- ,(1995)