Submodeling Analysis for Path-Dependent Thermomechanical Problems

摘要: In a finite element analysis, when localized behavior of large model is particular concern, generally one would refine the mesh until it captures local solution adequately. Submodeling an alternative way for solving this kind problem. It provides relatively accurate at modest computational cost. For valid submodeling boundaries submodel should be sufficiently far away from features so that St. Venant’s principle holds. Moreover, special treatments are required problems involve path-dependent characteristics. This paper presents general procedure to perform analyses thermomechanical without priori assumptions on structural response. The was benchmarked using bimaterial strip and demonstrated through bump chip carrier package assembly. conducive numerical assessment fatigue lives electronic packages.