Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly
作者： Yi-Shao Lai , Tong Hong Wang
DOI: 10.1016/J.MICROREL.2004.09.007
关键词:
摘要: In this paper we verified the submodeling technique applied in thermomechanical reliability assessment of a flip-chip BGA under accelerated thermal cycling test conditions. Since steady-state creep model was implemented for solder bump to better represent its realistic mechanical behavior, procedures developed specifically path-dependent problems were considered. A detailed global built up verify solutions. This also served as benchmark examine solution discrepancies caused by different simplifications model.
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sci-hub.se 参考文章(11)
Robert Darveaux, Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction Journal of Electronic Packaging. ,vol. 124, pp. 147- 154 ,(2002) , 10.1115/1.1413764
Tong Hong Wang, Yi-Shao Lai, Submodeling Analysis for Path-Dependent Thermomechanical Problems Journal of Electronic Packaging. ,vol. 127, pp. 135- 140 ,(2005) , 10.1115/1.1869513
S. M. Hsu, J. C. Lin, K. N. Chiang, A Full-Scale 3D Finite Element Analysis for No-Underfill Flip Chip Package Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. pp. 311- 318 ,(2002) , 10.1115/IMECE2002-39674
Y. W. Chan, T. H. Ju, Saeed A. Hareb, Y. C. Lee, Jih-Shun Wu, Mirng-Ji Lii, Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints Journal of Electronic Packaging. ,vol. 124, pp. 246- 253 ,(2002) , 10.1115/1.1451844
J. S. Corbin, Finite element analysis for solder ball connect (SBC) structural design optimization Ibm Journal of Research and Development. ,vol. 37, pp. 585- 596 ,(1993) , 10.1147/RD.375.0585
Yu Gu, Toshio Nakamura, William T. Chen, Brian Cotterell, Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages Journal of Electronic Packaging. ,vol. 123, pp. 295- 301 ,(2001) , 10.1115/1.1348338
J. J. Skrzypek, R. B. Hetnarski, Z. Mro´z, Plasticity and Creep Journal of Applied Mechanics. ,vol. 61, pp. 749- 750 ,(1994) , 10.1115/1.2901536
Bart Vandevelde, Dominiek Degryse, Eric Beyne, Eric Roose, Dorina Corlatan, Guido Swaelen, Geert Willems, Filip Christiaens, Alcatel Bell, Dirk Vandepitte, Martine Baelmans, Modified micro–macro thermo-mechanical modelling of ceramic ball grid array packages Microelectronics Reliability. ,vol. 43, pp. 307- 318 ,(2003) , 10.1016/S0026-2714(02)00263-9
J. Wilde, K. Becker, M. Thoben, W. Blum, T. Jupitz, Guozhong Wang, Z.N. Cheng, Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder IEEE Transactions on Advanced Packaging. ,vol. 23, pp. 408- 414 ,(2000) , 10.1109/6040.861554
G. Gustafsson, I. Guven, V. Kradinov, E. Madenci, Finite element modeling of BGA packages for life prediction electronic components and technology conference. pp. 1059- 1063 ,(2000) , 10.1109/ECTC.2000.853300