Solder Joint Thermal Fatigue Analysis of 48-FBGA
作者： Song Chen , Taekoo Lee , Jaisun Lee , Nufeng Feng
DOI: 10.1109/ICEPT.2006.359816
关键词:
摘要: A three-dimensional finite element model has been developed to study the solder joint reliability of 48-I/O fine pitch Ball-Grid-Array (FBGA) assembly. Anand was selected describe 62Sn36Pb2Ag creep behavior. Sub-modeling technique used transfer displacements local for a detailed analysis under thermal cycling conditions. Solder ball visco-plastic energy accumulated per temperature cycle applied in this BGA product predict fatigue life. In addition, effect PCB thickness pointed briefly.
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